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  lead-free parts pb round type led lamps ligitek electronics co.,ltd. property of ligitek only data sheet LSE3331-PF LSE3331-PF - 2006 a doc. no : qw0905- rev. : date : 12 - dec.
0 -60 100% 50% 75% 25% -30 100% 25% 0 50%75% 30 60 0.5 typ 25.0min 1.0min note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 2.54typ 5.9 8.6 ligitek electronics co.,ltd. property of ligitek only LSE3331-PF part no. 1.5max package dimensions 7.6 5.0 1/5 page + -
absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) ma 80 i fp peak forward current duty 1/10@10khz max. forward voltage @ ma(v) color note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. emitted LSE3331-PFgaasp/gap orange material part no min. lens 61045 1.7 2.6 peak wave length pnm spectral halfwidth nm 20 reverse current @5v power dissipation operating temperature storage temperature tstg t opr pd ir -40 ~ +85 -40 ~ +100 80 10 min. typ. 45 2020 viewing angle 2 1/2 (deg) luminous intensity @10ma(mcd) mw a ligitek electronics co.,ltd. property of ligitek only symbol forward current parameter i f se 20 ratings unit ma page2/5 orange transparent part no. LSE3331-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 se chip page3/5 part no. LSE3331-PF
ligitek electronics co.,ltd. property of ligitek only dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 25 0 0 120 260 temp( c) 2 /sec max preheat 50 100 260 c3sec max 5 /sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile time(sec) 150 page 4/5 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max part no. LSE3331-PF
mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solderability test thermal shock test solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 the purpose of this test is the resistance of the device under tropical for hours. ligitek electronics co.,ltd. property of ligitek only reliability test: high temperature high humidity test low temperature storage test operating life test high temperature storage test test item 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test condition description mil-std-202:103b jis c 7021: b-11 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reference standard page5/5 part no. LSE3331-PF


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